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HMD Fusion对比

HMD Fusion
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Price: 从 RM1099   1299
发布
Release Status Release 2024, Oct 01
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A78 & 6x2.0 GHz Cortex-A55)
Chipset Qualcomm SM4450 Snapdragon 4 Gen 2 (4 nm)
GPU Adreno 613
Memory 8GB RAM, 256GB ROM
Card Slot microSDXC (uses shared SIM slot)
Battery 5000 mAh, user replaceable battery
33W wired, PD, QC
OS Android 14, up to 2 major Android upgrades
显示屏
Display Type IPS LCD, 90Hz, 480 nits (typ), 600 nits (peak)
Display Size 6.56 inches, 103.4 cm2 (~83.4% screen-to-body ratio)
720 x 1612 pixels, 20:9 ratio (~269 ppi density)
机身
Body Dimension 164.2 x 75.5 x 8.3 mm
Body Weight 202.5g
Body Type Glass front, plastic frame, plastic back
IP54 dust protected and water resistant (water splashes)
HMD Fusion toolkit: CAD file and API access for building your own outfits
Repair-it-yourself capable (display, back cover, battery and charging port repairs)
Colors Noir
摄像头
Rear Camera Dual: 108 MP, (wide), AF + 2 MP, (depth)
Front Camera 50 MP
Video 1080p@30fps, gyro-EIS
Selfie: Yes
Camera Features LED flash, HDR
连接与通讯
Sim Card Nano-SIM + eSIMNano-SIM + Nano-SIM
Data Speed HSPA, LTE, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac/6
Bluetooth 5.1, A2DP, LE, aptX Adaptive
NFC Yes
USB USB Type-C 2.0, OTG, magnetic accessory connector pins
传感器
Sensor Fingerprint (side-mounted), accelerometer, gyro, proximity, compass
GPS GPS, GALILEO, GLONASS, BDS
音频
Loud Speaker Yes
3.5mm Jack Yes

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