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HONOR Pad X8b 对比 HONOR Pad X9a

HONOR Pad X8b
HONOR Pad X9a
Price: 从 RM999   从 RM1299  
发布
Release Status Release 2026, Apr 22 Release 2025, Apr 10
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 610 Adreno 610
Memory 8GB RAM, 256GB ROM (8GB HONOR RAM Turbo included) 16GB (8GB + 8GB), 256GB
Card Slot microSDXC No
Battery Li-Ion 10100 mAh battery Li-Ion 8300 mAh battery
35W wired
OS Android 16, MagicOS 10 Android 15, MagicOS 9
显示屏
Display Type TFT LCD, 90Hz, 500 nits TFT LCD, 120Hz, 400 nits (peak)
Display Size 11.0 inches, 347.5 cm2 (~80.3% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)		 11.5 inches, 376.3 cm2 (~84.1% screen-to-body ratio)
1504 x 2508 pixels, 5:3 ratio (~254 ppi density)
机身
Body Dimension 256.9 x 168.5 x 7.3 mm 267.3 x 167.4 x 6.8 mm
Body Weight 496g 475g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray Gray
摄像头
Rear Camera 5 MP, f/2.0, AF 8 MP, f/2.0, (wide), 1/5.0"
Front Camera 5 MP, f/2.0 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps		 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card Nano-SIM No
Data Speed HSPA, LTE - cellular model only
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C
传感器
Sensor Accelerometer Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio		 No

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