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Honor Pad X9对比

Price: RM889   1499
发布
Release Status Release 2023, Jul 20
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 610
Memory 256GB, 8GB RAM
Card Slot No
Battery Li-Po 7250 mAh, non-removable battery
OS Android 13, MagicOS 7.1
显示屏
Display Type TFT LCD, 120Hz
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm
Body Weight 495g
Body Type Glass front, aluminum frame, aluminum back
Colors Space Gray
摄像头
Rear Camera 5 MP, f/2.2, AF
Front Camera 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE
NFC No
USB USB Type-C, OTG
传感器
Sensor Accelerometer
音频
Loud Speaker Yes, with stereo speakers (6 speakers)
3.5mm Jack No

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