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HONOR Pad X10 Pro Max 马来西亚价格,功能与规格参数

HONOR Pad X10 Pro Max 搭载了Qualcomm SM6225-AF Snapdragon 6s 4G Gen 2 (6 nm) 处理器、13.0寸的TFT LCD、128GB 6GB RAM, 128GB 8GB RAM, 256GB 8GB RAM搭配。摄像头方面,则是采用后置5 MP, f/2.2, AF。其他配置方面,HONOR Pad X10 Pro Max 搭载了Li-Po 10100 mAh电池容量、运行基于Android 16, MagicOS 10、支持Wifi, Bluetoth 以及N/A。手机的厚度为6.7 mm而重量是618g。

HONOR Pad X10 Pro Max 功能与规格参数

发布
Release Status Available. Released 2026, September 28
性能与续航
CPU Octa-core (4x2.9 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6225-AF Snapdragon 6s 4G Gen 2 (6 nm)
GPU Adreno 610
Memory 128GB 6GB RAM, 128GB 8GB RAM, 256GB 8GB RAM
Card Slot microSDXC (dedicated slot)
Battery Li-Po 10100 mAh battery
45W wired
OS Android 16, MagicOS 10
显示屏
Display Type TFT LCD, 1B colors, 120Hz, IMAX Enhanced, 700 nits (HBM)
Display Size 13.0 inches, 489.7 cm2 (~85.4% screen-to-body ratio)
1560 x 2500 pixels, 16:10 ratio (~227 ppi density)
机身
Body Dimension 297.6 x 192.7 x 6.7 mm
Body Weight 618g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray, Light Green
摄像头
Rear Camera 5 MP, f/2.2, AF
Front Camera 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No
Data Speed N/A
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE, aptX HD, LHDC 5
NFC No
USB USB Type-C 2.0, OTG
传感器
Sensor Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (4 speakers)
3.5mm Jack No
*规格配置如有更改,恕不另行通知。

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