Honor X5 Plus 马来西亚价格，功能与规格参数
- 更新: Mar 12, 2024
从 RM449 对比
Honor X5 Plus 搭载了MediaTek Helio G36 处理器、6.56寸的TFT LCD、4GB RAM, 64GB ROM搭配。其他配置方面，Honor X5 Plus 搭载了5200 mAh电池容量、运行基于MagicOS 7.1 (Based on Android 13)、支持Wifi, Bluetoth, GPS, HSPA 以及LTE。手机的厚度为8.9 mm而重量是193g。
Honor X5 Plus 马来西亚市场价格从RM449起。
Honor X5 Plus功能与规格参数 | |
|---|---|
发布 | |
| Release Status | Release 2023, Sep 07 |
性能与续航 | |
| CPU | 4*Cortex-A53 up to 2.2Ghz+4*Cortex-A53 up to 1.6Ghz |
| Chipset | MediaTek Helio G36 |
| GPU | IMG GE8320 |
| Memory | 4GB RAM, 64GB ROM |
| Card Slot | MicroSD |
| Battery | 5200 mAh (typical value), 5V/2A Standard Charger Type-C, USB 2.0 |
| OS | MagicOS 7.1 (Based on Android 13) |
显示屏 | |
| Display Type | TFT LCD |
| Display Size | 6.56 inches, 720 × 1612 pixels, Aspect Ratio 20.15:9, 90Hz |
| Display Features | Water Drop Screen |
机身 | |
| Body Dimension | 164 x 75.6 x 8.9 mm |
| Body Weight | 193g |
| Body Type | Glass front, plastic back, plastic frame |
| Colors | Cyan Lake |
摄像头 | |
| Rear Camera | 50 MP camera (f/1.8)+depth camera (f/2.4) |
| Front Camera | 5 MP Camera (f/2.2 aperture) |
| Video | 1080p@30fps Selfie: 1080p@30fps |
| Camera Features | LED flash |
连接与通讯 | |
| Sim Card | Hybrid Dual SIM (Nano-SIM, dual stand-by) |
| Data Speed | HSPA, LTE |
| WLAN | 802.11 a/b/g/n/ac, Wi-Fi Direct |
| Bluetooth | BT5.1, support BLE, SBC, AAC, LDAC, APTX, APTX HD |
| NFC | No |
| USB | microUSB 2.0, OTG |
传感器 | |
| Sensor | Fingerprint Sensor, Gravity Sensor, Ambient Light Sensor, Proximity Sensor |
| GPS | GPS, GLONASS, GALILEO, BDS |
音频 | |
| Loud Speaker | Yes |
| 3.5mm Jack | 3.5mm |
*规格配置如有更改，恕不另行通知。
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