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Redmi K70 Ultra对比

Price: RM1750  
发布
Release Status Available. Released 2024, July 19
性能与续航
CPU Octa-core (1x3.25 GHz Cortex-X4 & 3x2.85 GHz Cortex-X4 & 4x2.0 GHz Cortex-A720)
Chipset Mediatek Dimensity 9300+ (4 nm)
GPU Immortalis-G720 MC12
Memory 256GB 12GB RAM, 512GB 12GB RAM, 512GB 16GB RAM, 1TB 16GB RAM, 1TB 24GB RAM, UFS 4.0
Card Slot No
Battery Li-Po 5500 mAh, non-removable battery
120W wired, PD3.0, 100% in 24 min (advertised)
OS Android 14, HyperOS
显示屏
Display Type OLED, 68B colors, 144Hz, Dolby Vision, HDR10+, 1600 nits (HBM), 4000 nits (peak)
Display Size 6.67 inches, 107.4 cm2 (~89.1% screen-to-body ratio)
1220 x 2712 pixels, 20:9 ratio (~446 ppi density)
Display Features Scratch/drop-resistant glass
机身
Body Dimension 160.4 x 75.1 x 8.4 mm
Body Weight 211g
Body Type Glass front, aluminum frame
IP68 dust/water resistant (up to 2m for 30 min)
Colors Black, White, Violet, Green Championship Edition, Orange Championship Edition
摄像头
Rear Camera Triple: 50 MP, f/1.7, 23mm (wide), 1/1.56", 1.0µm, PDAF, OIS + 8 MP, 119˚ (ultrawide), 1/4.0", 1.12µm + 2 MP, f/2.4, (macro)
Front Camera 20 MP, (wide), 1/2.0", 0.8µm
Video 8K@24/30fps, 4K@24/30/60fps, 1080p@30/60/120/240/960fps, gyro-EIS
Selfie: 1080p@30fps
Camera Features Dual-LED dual-tone flash, HDR, panorama
Selfie: HDR
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by)
Data Speed HSPA, LTE, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac/6/7, dual-band, Wi-Fi Direct
Bluetooth 5.4, A2DP, LE, LHDC
NFC Yes
Infrared Yes
USB USB Type-C
传感器
Sensor Fingerprint (under display, optical), accelerometer, gyro, proximity, compass, color spectrum
GPS GPS (L1+L5), BDS (B1I+B1C+B2a+B2b), GALILEO (E1+E5a+E5b), QZSS (L1+L5), NavIC (L5), GLONASS
音频
Loud Speaker Yes, with stereo speakers
3.5mm Jack No
24-bit/192kHz Hi-Res Wireless audio

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