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Honor Pad 9 对比 HONOR Pad X9a

Price: RM880   1499 RM999  
发布
Release Status Release 2024, Mar 20 Release 2025, Apr 10
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 710 Adreno 610
Memory 256GB, 8GB RAM 16GB (8GB + 8GB), 128GB
Card Slot No No
Battery 8300 mAh, non-removable battery
35W wired
Li-Ion 8300 mAh battery
35W wired
OS Android 13, Magic OS 7.2 Android 15, MagicOS 9
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) TFT LCD, 120Hz, 400 nits (peak)
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
11.5 inches, 376.3 cm2 (~84.1% screen-to-body ratio)
1504 x 2508 pixels, 5:3 ratio (~254 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 7 mm 267.3 x 167.4 x 6.8 mm
Body Weight 559g 475g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray, Cyan Lake Gray
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 8 MP, f/2.0, (wide), 1/5.0"
Front Camera 8 MP, f/2.2, (wide) 5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No No
Data Speed -
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C
传感器
Sensor Accelerometer Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No No

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