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Redmi Pad SE 4G 对比 realme Pad Mini

Price: RM485   RM699  
发布
Release Status Coming soon. Exp. release 2024, August 08 Release 2022, Apr 20
性能与续航
CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset Mediatek Helio G85 (12 nm) Unisoc Tiger T616 (12 nm)
GPU Mali-G52 MC2 Mali-G57 MP1
Memory 8GB RAM, 256GB ROM 3GB RAM + 32GB ROM
Card Slot microSDXC (dedicated slot) microSDXC (uses shared SIM slot)
Battery 6650 mAh, non-removable battery
10W wired
6400 mAh, non-removable battery
18W wired
5W reverse wired
OS Android 14, HyperOS Android 11
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 600 nits (HBM) IPS LCD
Display Size 8.7 inches, 214.9 cm2 (~80.9% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
8.7 inches, 214.9 cm2 (~81.5% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 211.6 x 125.5 x 8.8 mm 211.8 x 124.5 x 7.6 mm
Body Weight 370g 372g
Body Type Glass front (Gorilla Glass 3)
IP53, dust and splash resistant
Colors Forest Green, Ocean Blue, Urban Grey Gray, Blue
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4.0", 1.12µm 8 MP, f/2.0
Front Camera 5 MP, f/2.2, (wide), 1/5.0", 1.12µm 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie:
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by) Wifi
Data Speed HSPA, LTE NA
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.3, A2DP, LE 5.0, A2DP, LE
NFC No No
Infrared Yes
USB USB Type-C 2.0 USB Type-C 2.0, OTG
传感器
Sensor Accelerometer, proximity (accessories only), compass
Virtual proximity sensing
Accelerometer, proximity
GPS GPS, GALILEO, GLONASS, BDS GPS, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers
3.5mm Jack Yes Yes

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