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Honor Pad V9 对比 Honor Pad X9

Price: RM1999   RM889   1499
发布
Release Status Release 2025, Apr 11 Release 2023, Jul 20
性能与续航
CPU Octa-core (1x3.35 GHz Cortex-A715 & 3x3.20 GHz Cortex-A715 & 4x2.20 GHz Cortex-A510) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Mediatek Dimensity 8350 (4 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Mali G615-MC6 Adreno 610
Memory 24GB (12GB + 12GB), 256GB 256GB, 8GB RAM
Card Slot No No
Battery Si/C Li-Ion 10100 mAh battery
35W wired - Global
66W wired - China
Li-Po 7250 mAh, non-removable battery
OS Android 15, MagicOS 9 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 1B colors, 144Hz, HDR, 500 nits (typ) TFT LCD, 120Hz
Display Size 11.5 inches, 391.6 cm2 (~85.8% screen-to-body ratio)
2800 x 1840 pixels, 3:2 ratio (~291 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 259.1 x 176.1 x 6.1 mm 267.3 x 167.4 x 6.9 mm
Body Weight 475g 495g
Body Type Honor Pencil 3 (15ms latency) Glass front, aluminum frame, aluminum back
Colors Violet, Gray, White Space Gray
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 5 MP, f/2.2, AF
Front Camera 8 MP, f/2.0, (wide) 5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.2, A2DP, LE, aptX HD 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0, magnetic connector USB Type-C, OTG
传感器
Sensor Accelerometer, proximity (accessories only), gyro Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack No
24-bit/192kHz Hi-Res audio IMAX Enhanced
No

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