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Honor Pad X7 对比 Redmi Pad 2

Price: RM499   RM799  
发布
Release Status Release 2025, Sep 26 Release 2025, Jun 20
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 (6 nm) Mediatek Helio G100 Ultra (6 nm)
GPU Adreno 610 Mali-G57 MC2
Memory 128GB 4GB RAM 8GB RAM, 256GB ROM
Card Slot microSDXC microSDXC (uses shared SIM slot)
Battery Li-Ion 7020 mAh battery
10W wired
Li-Po 9000 mAh battery
18W wired, PD2, QC2.0
OS Android 15, MagicOS 9 Android 15, HyperOS 2
显示屏
Display Type IPS LCD, 90Hz, 500 nits (typ), 625 nits (HBM) IPS LCD, 1B colors, 90Hz, 600 nits (HBM)
Display Size 8.7 inches, 214.9 cm2 (~81.3% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
11.0 inches, 350.9 cm2 (~83.0% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~274 ppi density)
机身
Body Dimension 211.8 x 124.8 x 8 mm 254.6 x 166 x 7.4 mm
Body Weight 365g 519g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame
Stylus support
Colors Gray Graphite Gray, Mint Green, Lavender Purple
摄像头
Rear Camera 8 MP, f/2.0, AF 8 MP, f/2.0, (wide), 1/4.0\", 1.12µm
Front Camera 5 MP, f/2.2 5 MP, f/2.2, (wide), 1/5.0\", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR HDR
Selfie: HDR
连接与通讯
Sim Card No No. Wifi Version
Data Speed NA
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.0, A2DP, LE 5.3, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, OTG
传感器
Sensor Accelerometer
Circle to Search
Accelerometer, gyro/compass (cellular model only)
GPS No GPS, GALILEO, GLONASS, BDS, QZSS (cellular model only)
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (4 speakers, with Dolby Atmos)
-26.9 LUFS (Good)
3.5mm Jack No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio
Yes
24-bit/192kHz Hi-Res audio

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