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Honor Pad X7 对比 Redmi Pad 2 9.7

Price: RM499   RM649  
发布
Release Status Release 2025, Sep 26 Release 2026, Apr 28
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) octa-core processor
Chipset Qualcomm SM6225 Snapdragon 680 (6 nm) Snapdragon® 6s 4G Gen 2 6nm
GPU Adreno 610 Adreno 610
Memory 128GB 4GB RAM 4GB, 64GB LP4X+UFS2.2
Card Slot microSDXC Up to 2TB storage expansion
Battery Li-Ion 7020 mAh battery
10W wired
7600mAh, 18W Fast charging (in box 15W), USB Type-C
OS Android 15, MagicOS 9 Xiaomi HyperOS 3
显示屏
Display Type IPS LCD, 90Hz, 500 nits (typ), 625 nits (HBM) 2K, 120Hz crystal-clear display, Brightness: 500 nits (typ), 600 nits (Outdoor mode)TÜV Rheinland Low Blue Light (Software Solution) Certified TÜV Rheinland Flicker Free Certified TÜV Rheinland Circadian Friendly Certified
Display Size 8.7 inches, 214.9 cm2 (~81.3% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
9.7" 16:10, 2048x1280, Screen-to-body ratio: 84.70%
Display Features TÜV Rheinland Certification
机身
Body Dimension 211.8 x 124.8 x 8 mm
Body Weight 365g 519g
Body Type Glass front, aluminum frame, aluminum back All-metal design
Colors Gray Silver, Graphite Gray
摄像头
Rear Camera 8 MP, f/2.0, AF 8MP rear cameraf/2.0, 1.12μm pixel size
Front Camera 5 MP, f/2.2 5MP front cameraf/2.2, 1.12μm pixel size
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR HDR
Selfie: HDR
连接与通讯
Sim Card No Nano-SIM + Nano-SIM (cellular model only)
Data Speed HSPA, LTE - cellular model only
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band 2.4GHz
Bluetooth 5.0, A2DP, LE 5GHz Bluetooth 5.0
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, OTG
传感器
Sensor Accelerometer
Circle to Search
Virtual ambient light sensor | Accelerometer | Hall sensor
GPS No GPS, GALILEO, GLONASS, BDS, QZSS (cellular model only)
音频
Loud Speaker Yes, with stereo speakers Dual speakers
3.5mm Jack No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio
3.5mm headphone jack

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