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Honor Pad X8a 对比 OPPO Pad SE

Price: RM675   799 RM699  
发布
Release Status Release 2024, Oct 18 Release 2025, May 15
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Mediatek Helio G100 (6 nm)
GPU Adreno 610 Mali-G57 MC2
Memory 8GB of RAM (including 4GB HONOR RAM Turbo), 128GB ROM 4GB RAM, 128GB ROM
Card Slot No No
Battery Li-Ion 8300 mAh, non-removable battery 9340 mAh battery
33W wired, 33W UFCS, PD
OS Android 14, MagicOS 8 Android 15, ColorOS 15
显示屏
Display Type TFT LCD, 90Hz, 400 nits IPS LCD, 1B colors, 90Hz, 500 nits (peak)
Display Size 11.0 inches, 350.9 cm2 (~81.0% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~206 ppi density)
11.0 inches, 350.9 cm2 (~82.7% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~206 ppi density)
机身
Body Dimension 257 x 168.5 x 7.3 mm 254.9 x 166.5 x 7.4 mm
Body Weight 495g 530g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray Starlight Silver, Twilight Blue
摄像头
Rear Camera 5 MP, f/2.2, AF 5 MP, f/2.2, (wide), AF
Front Camera 5 MP, f/2.2 5 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR Panorama
Selfie: Panorama
连接与通讯
Sim Card No Nano-SIM - cellular model only
Data Speed LTE - cellular model only
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.4, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only), compass (LTE model only)
GPS No GPS, GLONASS (cellular model only)
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers
3.5mm Jack No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio
3.5mm audio jack

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