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Redmi Pad 2 对比 Honor Pad X7

Price: 从 RM699   从 RM499  
发布
Release Status Release 2025, Jun 20 Release 2025, Sep 26
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Mediatek Helio G100 Ultra (6 nm) Qualcomm SM6225 Snapdragon 680 (6 nm)
GPU Mali-G57 MC2 Adreno 610
Memory 4GB RAM, 128GB ROM 128GB 4GB RAM
Card Slot microSDXC (uses shared SIM slot) microSDXC
Battery Li-Po 9000 mAh battery
18W wired, PD2, QC2.0
Li-Ion 7020 mAh battery
10W wired
OS Android 15, HyperOS 2 Android 15, MagicOS 9
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 600 nits (HBM) IPS LCD, 90Hz, 500 nits (typ), 625 nits (HBM)
Display Size 11.0 inches, 350.9 cm2 (~83.0% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~274 ppi density)
8.7 inches, 214.9 cm2 (~81.3% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
机身
Body Dimension 254.6 x 166 x 7.4 mm 211.8 x 124.8 x 8 mm
Body Weight 519g 365g
Body Type Glass front, aluminum frame
Stylus support
Glass front, aluminum frame, aluminum back
Colors Graphite Gray, Mint Green, Lavender Purple Gray
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4.0\", 1.12µm 8 MP, f/2.0, AF
Front Camera 5 MP, f/2.2, (wide), 1/5.0\", 1.12µm 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
Selfie: HDR
HDR
连接与通讯
Sim Card Nano-SIM + Nano-SIM (cellular model only) No
Data Speed HSPA, LTE - cellular model only
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.3, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, OTG
传感器
Sensor Accelerometer, gyro/compass (cellular model only) Accelerometer
Circle to Search
GPS GPS, GALILEO, GLONASS, BDS, QZSS (cellular model only) No
音频
Loud Speaker Yes, with stereo speakers (4 speakers, with Dolby Atmos)
-26.9 LUFS (Good)
Yes, with stereo speakers
3.5mm Jack Yes
24-bit/192kHz Hi-Res audio
No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio

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