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Redmi Pad SE 4G 对比 Redmi Pad

Price: RM485   RM599   1099
发布
Release Status Coming soon. Exp. release 2024, August 08 Release 2022, Oct 05
性能与续航
CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
Chipset Mediatek Helio G85 (12 nm) MediaTek Helio G99 (6nm)
GPU Mali-G52 MC2 Mali-G57 MC2
Memory 8GB RAM, 256GB ROM 6GB RAM, 128GB ROM
Card Slot microSDXC (dedicated slot) microSDXC
Battery 6650 mAh, non-removable battery
10W wired
Li-Po 8000 mAh, non-removable battery
Fast charging 18W
OS Android 14, HyperOS Android 12, MIUI 13
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 600 nits (HBM) IPS LCD, 1B colors, 90Hz, 400 nits (typ)
Display Size 8.7 inches, 214.9 cm2 (~80.9% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~220 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 211.6 x 125.5 x 8.8 mm 250.5 x 158.1 x 7.1 mm
Body Weight 370g 465g
Body Type Glass front (Gorilla Glass 3)
IP53, dust and splash resistant
Metal frame
Colors Forest Green, Ocean Blue, Urban Grey Graphite Gray, Moonlight Silver, Mint Green
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4.0", 1.12µm 8 MP, AF
Front Camera 5 MP, f/2.2, (wide), 1/5.0", 1.12µm 8 MP, 105°
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by) No
Data Speed HSPA, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.3, A2DP, LE 5.3, A2DP, LE
NFC No No
Infrared Yes
USB USB Type-C 2.0 USB Type-C
传感器
Sensor Accelerometer, proximity (accessories only), compass
Virtual proximity sensing
Yes
GPS GPS, GALILEO, GLONASS, BDS Unspecified
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (4 speakers)
3.5mm Jack Yes No

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