Honor Pad X8 Pro 马来西亚价格,功能与规格参数

Honor Pad X8 Pro 搭载了Qualcomm SM6225 Snapdragon 685 (6 nm) 处理器、11.5寸的TFT LCD、128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM搭配。摄像头方面,则是采用后置5 MP, f/2.2, AF。其他配置方面,Honor Pad X8 Pro 搭载了Li-Po 7250 mAh电池容量、运行基于Android 13, MagicOS 7.1、支持Wifi 以及Bluetoth。手机的厚度为6.9 mm而重量是495g。

Honor Pad X8 Pro功能与规格参数

发布
Release Status Available. Released 2023, July 05
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 610
Memory 128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM
Card Slot No
Battery Li-Po 7250 mAh, non-removable battery
OS Android 13, MagicOS 7.1
显示屏
Display Type TFT LCD, 120Hz
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm
Body Weight 495g
Body Type Glass front, aluminum frame, aluminum back
Colors Gray, Purple, Mint
摄像头
Rear Camera 5 MP, f/2.2, AF
Front Camera 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE
NFC No
USB USB Type-C, OTG
传感器
Sensor Accelerometer
音频
Loud Speaker Yes, with stereo speakers (6 speakers)
3.5mm Jack No
*规格配置如有更改,恕不另行通知。

评论: