Honor Pad X8 Pro 马来西亚价格,功能与规格参数
- 更新: May 02, 2024
从 N/A 对比
Honor Pad X8 Pro 搭载了Qualcomm SM6225 Snapdragon 685 (6 nm) 处理器、11.5寸的TFT LCD、128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM搭配。摄像头方面,则是采用后置5 MP, f/2.2, AF。其他配置方面,Honor Pad X8 Pro 搭载了Li-Po 7250 mAh电池容量、运行基于Android 13, MagicOS 7.1、支持Wifi 以及Bluetoth。手机的厚度为6.9 mm而重量是495g。
Honor Pad X8 Pro功能与规格参数 | |
---|---|
发布 | |
Release Status | Available. Released 2023, July 05 |
性能与续航 | |
CPU | Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) |
Chipset | Qualcomm SM6225 Snapdragon 685 (6 nm) |
GPU | Adreno 610 |
Memory | 128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM |
Card Slot | No |
Battery | Li-Po 7250 mAh, non-removable battery |
OS | Android 13, MagicOS 7.1 |
显示屏 | |
Display Type | TFT LCD, 120Hz |
Display Size | 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio) 1200 x 2000 pixels, 5:3 ratio (~203 ppi density) |
机身 | |
Body Dimension | 267.3 x 167.4 x 6.9 mm |
Body Weight | 495g |
Body Type | Glass front, aluminum frame, aluminum back |
Colors | Gray, Purple, Mint |
摄像头 | |
Rear Camera | 5 MP, f/2.2, AF |
Front Camera | 5 MP, f/2.2 |
Video | 1080p@30fps Selfie: 1080p@30fps |
Camera Features | HDR |
连接与通讯 | |
Sim Card | No |
WLAN | Wi-Fi 802.11 a/b/g/n/ac, dual-band |
Bluetooth | 5.1, A2DP, LE |
NFC | No |
USB | USB Type-C, OTG |
传感器 | |
Sensor | Accelerometer |
音频 | |
Loud Speaker | Yes, with stereo speakers (6 speakers) |
3.5mm Jack | No |
*规格配置如有更改,恕不另行通知。
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