Honor X50 马来西亚价格,功能与规格参数

Honor X50 搭载了Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) 处理器、6.78寸的AMOLED、128GB 8GB RAM, 256GB 8GB RAM, 256GB 12GB RAM, 512GB 16GB RAM搭配。摄像头方面,则是采用后置Dual: 108 MP, f/1.8, (wide), 1/1.67", PDAF + 2 MP, f/2.4, (macro)。其他配置方面,Honor X50 搭载了Li-Po 5800 mAh电池容量、运行基于Android 13, Magic UI 7.1、支持Wifi, Bluetoth, HSPA, LTE-A 以及5G。手机的厚度为8 mm而重量是185g。

Honor X50功能与规格参数

发布
Release Status Available. Released 2023, July 05
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Adreno 710
Memory 128GB 8GB RAM, 256GB 8GB RAM, 256GB 12GB RAM, 512GB 16GB RAM
Card Slot No
Battery Li-Po 5800 mAh, non-removable battery
35W wired
6W reverse wired
OS Android 13, Magic UI 7.1
显示屏
Display Type AMOLED, 1B colors, 120Hz, 1200 nits (peak)
Display Size 6.78 inches, 112.6 cm2 (~91.2% screen-to-body ratio)
1220 x 2652 pixels, 19.5:9 ratio (~431 ppi density)
机身
Body Dimension 163.6 x 75.5 x 8 mm
Body Weight 185g
Body Type IP53, dust and splash resistant
Colors Black, Blue, Silver, Orange
摄像头
Rear Camera Dual: 108 MP, f/1.8, (wide), 1/1.67", PDAF + 2 MP, f/2.4, (macro)
Front Camera 8 MP, f/2.0, (wide)
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash, panorama, HDR
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by)
Data Speed HSPA, LTE-A, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE
NFC No
Infrared Yes
USB USB Type-C 2.0, OTG
传感器
Sensor Fingerprint (under display, optical), accelerometer, gyro, proximity, compass
音频
Loud Speaker Yes
3.5mm Jack No
24-bit/192kHz audio
*规格配置如有更改,恕不另行通知。

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