Redmi K70E 马来西亚价格,功能与规格参数

Redmi K70E 搭载了Mediatek Dimensity 8300 Ultra (4 nm) 处理器、6.67寸的OLED、256GB 12GB RAM, 512GB 12GB RAM, 1TB 16GB RAM, UFS 4.0搭配。摄像头方面,则是采用后置Triple: 64 MP, (wide), 1/2", PDAF, OIS + 8 MP, 120˚, (ultrawide) + 2 MP, (macro)。其他配置方面,Redmi K70E 搭载了Li-Po 5500 mAh电池容量、运行基于Android 14, HyperOS、支持Wifi, Bluetoth, NFC, GPS, HSPA, LTE-A 以及5G。手机的厚度为8.1 mm而重量是198g。

Redmi K70E功能与规格参数

发布
Release Status Available. Released 2023, November 29
性能与续航
CPU Octa-core 3.35 GHz
Chipset Mediatek Dimensity 8300 Ultra (4 nm)
GPU Mali G615-MC6
Memory 256GB 12GB RAM, 512GB 12GB RAM, 1TB 16GB RAM, UFS 4.0
Card Slot No
Battery Li-Po 5500 mAh, non-removable battery
90W wired, PD3.0, QC2, 100% in 34 min (advertised)
OS Android 14, HyperOS
显示屏
Display Type OLED, 68B colors, 120Hz, Dolby Vision, HDR10+, 1800 nits (peak)
Display Size 6.67 inches, 107.4 cm2 (~90.1% screen-to-body ratio)
1220 x 2712 pixels, 20:9 ratio (~446 ppi density)
机身
Body Dimension 160.5 x 74.3 x 8.1 mm
Body Weight 198g
Colors Black, White, Mint
摄像头
Rear Camera Triple: 64 MP, (wide), 1/2", PDAF, OIS + 8 MP, 120˚, (ultrawide) + 2 MP, (macro)
Front Camera 16 MP, (wide)
Video 4K@24/30/60/120/240/960fps, 720p@1920fps, gyro-EIS
Selfie: 1080p@30/60fps, gyro-EIS
Camera Features LED flash, HDR, panorama
Selfie: HDR, panorama
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by)
Data Speed HSPA, LTE-A, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
Bluetooth 5.4, A2DP, LE
NFC Yes
Infrared Yes
USB USB Type-C, OTG
传感器
Sensor Fingerprint (under display, optical), accelerometer, proximity, gyro, compass
GPS GPS, GALILEO, GLONASS, QZSS, BDS (B1I+B1c)
音频
Loud Speaker Yes, with stereo speakers
3.5mm Jack No
24-bit/192kHz audio
*规格配置如有更改,恕不另行通知。

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