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Honor Pad X7对比

Price: RM499  
发布
Release Status Release 2025, Sep 26
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6225 Snapdragon 680 (6 nm)
GPU Adreno 610
Memory 128GB 4GB RAM
Card Slot microSDXC
Battery Li-Ion 7020 mAh battery
10W wired
OS Android 15, MagicOS 9
显示屏
Display Type IPS LCD, 90Hz, 500 nits (typ), 625 nits (HBM)
Display Size 8.7 inches, 214.9 cm2 (~81.3% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
机身
Body Dimension 211.8 x 124.8 x 8 mm
Body Weight 365g
Body Type Glass front, aluminum frame, aluminum back
Colors Gray
摄像头
Rear Camera 8 MP, f/2.0, AF
Front Camera 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.0, A2DP, LE
NFC No
USB USB Type-C, OTG
传感器
Sensor Accelerometer
Circle to Search
GPS No
音频
Loud Speaker Yes, with stereo speakers
3.5mm Jack No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio

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