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Honor Pad X7 对比 Redmi Pad SE 4G

Price: RM499   RM485  
发布
Release Status Release 2025, Sep 26 Coming soon. Exp. release 2024, August 08
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 (6 nm) Mediatek Helio G85 (12 nm)
GPU Adreno 610 Mali-G52 MC2
Memory 128GB 4GB RAM 8GB RAM, 256GB ROM
Card Slot microSDXC microSDXC (dedicated slot)
Battery Li-Ion 7020 mAh battery
10W wired
6650 mAh, non-removable battery
10W wired
OS Android 15, MagicOS 9 Android 14, HyperOS
显示屏
Display Type IPS LCD, 90Hz, 500 nits (typ), 625 nits (HBM) IPS LCD, 1B colors, 90Hz, 600 nits (HBM)
Display Size 8.7 inches, 214.9 cm2 (~81.3% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
8.7 inches, 214.9 cm2 (~80.9% screen-to-body ratio)
800 x 1340 pixels, 5:3 ratio (~179 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 211.8 x 124.8 x 8 mm 211.6 x 125.5 x 8.8 mm
Body Weight 365g 370g
Body Type Glass front, aluminum frame, aluminum back Glass front (Gorilla Glass 3)
IP53, dust and splash resistant
Colors Gray Forest Green, Ocean Blue, Urban Grey
摄像头
Rear Camera 8 MP, f/2.0, AF 8 MP, f/2.0, (wide), 1/4.0", 1.12µm
Front Camera 5 MP, f/2.2 5 MP, f/2.2, (wide), 1/5.0", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No Dual SIM (Nano-SIM, dual stand-by)
Data Speed HSPA, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.0, A2DP, LE 5.3, A2DP, LE
NFC No No
Infrared Yes
USB USB Type-C, OTG USB Type-C 2.0
传感器
Sensor Accelerometer
Circle to Search
Accelerometer, proximity (accessories only), compass
Virtual proximity sensing
GPS No GPS, GALILEO, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers
3.5mm Jack No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio
Yes

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