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Honor Pad X8 对比 Honor Pad X9

Honor Pad X8
Honor Pad X9
Price: 从 RM799   899 从 RM889   1499
发布
Release Status Release 2022, Nov 03 Release 2023, Jul 20
性能与续航
CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset MediaTek MT8786 Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Mali-G52 Adreno 610
Memory 64GB, 4GB RAM 256GB, 8GB RAM
Card Slot microSDXC (dedicated) No
Battery Li-Po 5100 mAh, non-removable battery Li-Po 7250 mAh, non-removable battery
OS Android 10, Magic UI 4 Android 13, MagicOS 7.1
显示屏
Display Type TFT LCD TFT LCD, 120Hz
Display Size 10.1 inches, 295.8 cm2 (~77.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~224 ppi density)		 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 240.2 x 159 x 7.6 mm 267.3 x 167.4 x 6.9 mm
Body Weight 460g 495g
Body Type Glass front, aluminum frame, aluminum back
Colors Dark Blue, Light Blue Space Gray
摄像头
Rear Camera 5 MP 5 MP, f/2.2, AF
Front Camera 2 MP 5 MP, f/2.2
Video 1080p@30fps
Selfie:		 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card Yes No
Data Speed 4G LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, USB On-The-Go USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer
GPS Yes, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (6 speakers)
3.5mm Jack No No

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