Honor Pad X9 对比 Samsung Galaxy Tab S9 FE Plus 5G

Price: RM679   1099 RM2499   3399
发布
Release Status Release 2023, Jul 20 Release 2023, Oct 04
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (4x2.4 GHz Cortex-A78 & 4x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Exynos 1380 (5 nm)
GPU Adreno 610 Mali-G68 MP5
Memory 128GB, 4GB RAM 8GB RAM, 128GB ROM
Card Slot No microSDXC (dedicated slot)
Battery Li-Po 7250 mAh, non-removable battery Li-Po 10090 mAh, non-removable battery
45W wired, QC2.0
OS Android 13, MagicOS 7.1 Android 13, One UI 5.1
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 90Hz
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
12.4 inches, 445.8 cm2 (~84.3% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~243 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 285.4 x 185.4 x 6.5 mm
Body Weight 495g 628g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum back, aluminum frame
Stylus
IP68 dust/water resistant (up to 1.5m for 30 min)
Colors Space Gray Mint, Silver, Gray, Lavender
摄像头
Rear Camera 5 MP, f/2.2, AF Dual: 8 MP, (wide) + 8 MP, (ultrawide)
Front Camera 5 MP, f/2.2 12 MP, (ultrawide)
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: Yes
Camera Features HDR
连接与通讯
Sim Card No Nano-SIM
Data Speed HSPA, LTE-A (CA), 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.3, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, magnetic connector
传感器
Sensor Accelerometer Unspecified
GPS GPS, GLONASS, GALILEO
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers
3.5mm Jack No No
Tuned by AKG

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