Honor Pad X9 对比 Xiaomi Pad 6

Price: RM989   1499 RM1282   1499
发布
Release Status Release 2023, Jul 20 Release 2023, Jul 18
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (1x3.2 GHz Kryo 585 & 3x2.42 GHz Kryo 585 & 4x1.80 GHz Kryo 585)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM8250-AC Snapdragon 870 5G (7 nm)
GPU Adreno 610 Adreno 650
Memory 256GB, 8GB RAM 256GB 8GB RAM, UFS 3.1
Card Slot No No
Battery Li-Po 7250 mAh, non-removable battery Li-Po 8840 mAh, non-removable battery
33W wired, PD3.0, QC4
OS Android 13, MagicOS 7.1 Android 13, MIUI 14
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 1B colors, 144Hz, HDR10, Dolby Vision, 550 nits
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
11.0 inches, 350.9 cm2 (~83.6% screen-to-body ratio)
1800 x 2880 pixels, 16:10 ratio (~309 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 254 x 165.2 x 6.5 mm
Body Weight 495g 490g
Body Type Glass front, aluminum frame, aluminum back Glass front (Gorilla Glass 3), aluminum frame, aluminum back
Stylus support (magnetic)
Colors Space Gray Gravity Gray, Gold, Mist blue
摄像头
Rear Camera 5 MP, f/2.2, AF 13 MP, f/2.2, PDAF
Front Camera 5 MP, f/2.2 8 MP, f/2.2, 1/4", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30/60fps
Selfie: 1080p@30fps
Camera Features HDR Dual-LED flash, HDR, panorama
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/a/6, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.2, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 3.2, accessory connector
传感器
Sensor Accelerometer Accelerometer, gyro, proximity (accessories only)
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No No
24-bit/192kHz audio

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