Honor Pad 9 对比 Honor Pad X9

Price: RM1479   1799 RM989   1499
发布
Release Status Release 2024, Apr 22 Release 2023, Jul 20
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 710 Adreno 610
Memory 256GB, 16GB RAM 256GB, 8GB RAM
Card Slot microSDXC (cellular model only) No
Battery Li-Po 8300 mAh, non-removable battery
35W wired
Li-Po 7250 mAh, non-removable battery
OS Android 13, Magic OS 7.2 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) TFT LCD, 120Hz
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 6.9 mm 267.3 x 167.4 x 6.9 mm
Body Weight 568g 495g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum frame, aluminum back
Colors Space Gray, Cyan Lake Space Gray
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 5 MP, f/2.2, AF
Front Camera 8 MP, f/2.2, (wide) 5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR HDR
连接与通讯
Sim Card Yes No
Data Speed LTE, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (8 speakers)
-22.0 LUFS (Excellent)
Yes, with stereo speakers (6 speakers)
3.5mm Jack No No

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