Honor Pad V8 Pro 对比 Honor Pad X9

Price: RM679   1099
发布
Release Status Coming soon. Exp. release 2022, December 30 Release 2023, Jul 20
性能与续航
CPU Octa-core (4x2.85 GHz Cortex-A78 & 4x2.0 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset MediaTek Dimensity 8100 (5 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Mali-G610 MC6 Adreno 610
Memory 128GB 8GB RAM, 256GB 8GB RAM, 256GB 12GB RAM 128GB, 4GB RAM
Card Slot No No
Battery Li-Po 10050 mAh, non-removable battery
35W wired
Li-Po 7250 mAh, non-removable battery
OS Android 12, Magic UI 7 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 1B colors, 144Hz, 600 nits TFT LCD, 120Hz
Display Size 12.1 inches, 424.5 cm2 (~85.6% screen-to-body ratio)
2560 x 1600 pixels, 16:10 ratio (~249 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
Display Features IMAX enhanced
机身
Body Dimension 277 x 179 x 6.6 mm 267.3 x 167.4 x 6.9 mm
Body Weight 599g 495g
Body Type Glass front, aluminum frame, aluminum back or eco leather back
Honor Pencil 3 (15ms latency)
Glass front, aluminum frame, aluminum back
Colors Grey, Blue, Orange Space Gray
摄像头
Rear Camera 13 MP, f/2.0, (wide), 1/3", AF 5 MP, f/2.2, AF
Front Camera 5 MP, f/2.2 5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash, HDR HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.2, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, magnetic connector USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack No
24-bit/192kHz audio
No

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