Redmi Pad SE 对比 Honor Pad X9

Redmi Pad SE
Honor Pad X9
Price: 从 RM659   799 从 RM679   1099
发布
Release Status Release 2023, Sep 27 Release 2023, Jul 20
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 610 Adreno 610
Memory 8GB RAM, 256GB ROM 128GB, 4GB RAM
Card Slot microSDXC No
Battery Li-Po 8000 mAh, non-removable battery
10W wired		 Li-Po 7250 mAh, non-removable battery
OS Android 13, MIUI Pad 14 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) TFT LCD, 120Hz
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)		 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 267.3 x 167.4 x 6.9 mm
Body Weight 478g 495g
Body Type Glass front, aluminum back, aluminum frame Glass front, aluminum frame, aluminum back
Colors Lavender Purple, Graphite Gray, Mint Green Space Gray
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 5 MP, f/2.2, AF
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps		 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, OTG
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (6 speakers)
3.5mm Jack Yes
24-bit/192kHz audio		 No

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