Honor Pad X9 对比 Huawei MatePad 11 2023

Honor Pad X9
Huawei MatePad 11 2023
Price: 从 RM989   1499 从 RM1098   1799
发布
Release Status Release 2023, Jul 20 Release 2023, May 11
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (1x2.84 GHz Cortex-A77 & 3x2.42 GHz Cortex-A77 & 4x1.80 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM8250 Snapdragon 865 5G (7 nm+)
GPU Adreno 610 Adreno 650
Memory 256GB, 8GB RAM 6GB RAM, 128GB ROM
Card Slot No microSDXC (dedicated slot)
Battery Li-Po 7250 mAh, non-removable battery Li-Po 7250 mAh, non-removable battery
22.5W wired
5W reverse wired
OS Android 13, MagicOS 7.1 HarmonyOS 3.1
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 120Hz
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)		 11.0 inches, 348.3 cm2 (~83.1% screen-to-body ratio)
2560 x 1600 pixels, 16:10 ratio (~275 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 253.7 x 165.3 x 7.2 mm
Body Weight 495g 480g
Body Type Glass front, aluminum frame, aluminum back Stylus support (magnetic)
Colors Space Gray Graphite Black
摄像头
Rear Camera 5 MP, f/2.2, AF 13 MP, f/1.8, PDAF
Front Camera 5 MP, f/2.2 8 MP, f/2.0
Video 1080p@30fps
Selfie: 1080p@30fps		 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR LED flash, HDR, panorama
连接与通讯
Sim Card No Wifi
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 3.1, OTG
传感器
Sensor Accelerometer Accelerometer
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No No
Tuned by Harman Kardon

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