Honor Pad 9 对比 Redmi Pad SE

Price: RM1249   1499 RM659   799
发布
Release Status Release 2024, Mar 20 Release 2023, Sep 27
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 710 Adreno 610
Memory 256GB, 8GB RAM 8GB RAM, 256GB ROM
Card Slot No microSDXC
Battery 8300 mAh, non-removable battery
35W wired
Li-Po 8000 mAh, non-removable battery
10W wired
OS Android 13, Magic OS 7.2 Android 13, MIUI Pad 14
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) IPS LCD, 90Hz, 400 nits (typ)
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 7 mm 255.5 x 167.1 x 7.4 mm
Body Weight 559g 478g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum back, aluminum frame
Colors Space Gray, Cyan Lake Lavender Purple, Graphite Gray, Mint Green
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF
Front Camera 8 MP, f/2.2, (wide) 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only)
GPS No No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No Yes
24-bit/192kHz audio

热门对比·:

«
»