Honor Pad 8 对比 Redmi Pad SE

Price: RM599   1399 RM659   799
发布
Release Status Release 2022, Aug 25 Release 2023, Sep 27
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 610 Adreno 610
Memory 128GB, 6GB RAM 8GB RAM, 256GB ROM
Card Slot No microSDXC
Battery Li-Po 7250 mAh, non-removable battery
Fast charging 22.5W
Reverse charging 5W
Li-Po 8000 mAh, non-removable battery
10W wired
OS Android 12, Magic UI 6.1 Android 13, MIUI Pad 14
显示屏
Display Type IPS LCD, 1B colors, 350 nits (typ) IPS LCD, 90Hz, 400 nits (typ)
Display Size 12.0 inches, 409.9 cm2 (~84.5% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~194 ppi density)
11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
机身
Body Dimension 278.5 x 174.1 x 6.9 mm 255.5 x 167.1 x 7.4 mm
Body Weight 520g 478g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum back, aluminum frame
Colors Blue Hour Lavender Purple, Graphite Gray, Mint Green
摄像头
Rear Camera 5 MP 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF
Front Camera 5 MP 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, USB On-The-Go USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only)
GPS Unspecified No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No Yes
24-bit/192kHz audio

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