Redmi Pad 对比 Redmi Pad SE

Redmi Pad
Redmi Pad SE
Price: 从 RM759   899 从 RM729   799
发布
Release Status Release 2022, Oct 05 Release 2023, Sep 27
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset MediaTek Helio G99 (6nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Mali-G57 MC2 Adreno 610
Memory 3GB RAM, 64GB ROM 8GB RAM, 256GB ROM
Card Slot microSDXC microSDXC
Battery Li-Po 8000 mAh, non-removable battery
Fast charging 18W		 Li-Po 8000 mAh, non-removable battery
10W wired
OS Android 12, MIUI 13 Android 13, MIUI Pad 14
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 400 nits (typ) IPS LCD, 90Hz, 400 nits (typ)
Display Size 10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~220 ppi density)		 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
机身
Body Dimension 250.5 x 158.1 x 7.1 mm 255.5 x 167.1 x 7.4 mm
Body Weight 465g 478g
Body Type Metal frame Glass front, aluminum back, aluminum frame
Colors Graphite Gray, Moonlight Silver, Mint Green Lavender Purple, Graphite Gray, Mint Green
摄像头
Rear Camera 8 MP, AF 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF
Front Camera 8 MP, 105° 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps		 1080p@30fps
Selfie: 1080p@30fps
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.3, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C USB Type-C, OTG
传感器
Sensor Yes Accelerometer, proximity (accessories only)
GPS Unspecified No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No Yes
24-bit/192kHz audio

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