Redmi Pad SE 对比 realme Pad X

Price: RM659   799 RM709   1699
发布
Release Status Release 2023, Sep 27 Release 2022, May 26
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.2 GHz Kryo 660 Gold & 6x1.7 GHz Kryo 660 Silver)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6375 Snapdragon 695 5G (6 nm)
GPU Adreno 610 Adreno 619
Memory 8GB RAM, 256GB ROM 6GB RAM, 128GB ROM
Card Slot microSDXC microSDXC
Battery Li-Po 8000 mAh, non-removable battery
10W wired
Li-Po 8340 mAh, non-removable battery
Fast charging 33W
Reverse charging
USB Power Delivery
OS Android 13, MIUI Pad 14 Android, Realme UI 3.0
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) IPS LCD, 450 nits (peak)
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
10.95 inches, 341.3 cm2 (~82.6% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~213 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm
Body Weight 478g 499g
Body Type Glass front, aluminum back, aluminum frame Glass front, plastic frame, plastic back
Stylus support (magnetic charging)
Colors Lavender Purple, Graphite Gray, Mint Green Glowing Gray, Glacier Blue
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 13 MP, f/2.2, (wide)
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 8 MP, f/2.0, 105˚ (ultrawide)
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features Panorama
连接与通讯
Sim Card No Dual SIM (Nano-SIM, dual stand-by)
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 b/g/n/ac, hotspot
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, USB On-The-Go
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack Yes
24-bit/192kHz audio
No
24-bit/192kHz audio

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