HUAWEI MatePad Pro 13.2 对比 Honor Pad X9

Price: RM4999   RM989   1499
发布
Release Status Release 2024, Jan 09 Release 2023, Jul 20
性能与续航
CPU Octa-core (1x2.62 GHz Taishan Big & 3x2.15 GHz Taishan Mid & 4x1.53GHz Cortex-A510) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Kirin 9000S (7 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Maleoon 910 MP4 Adreno 610
Memory 12GB RAM, 512GB ROM 256GB, 8GB RAM
Card Slot No No
Battery Li-Po 10100 mAh, non-removable battery
88W wired, 85% in 40 min (advertised)
Li-Po 7250 mAh, non-removable battery
OS Harmony OS 4.0 Android 13, MagicOS 7.1
显示屏
Display Type OLED, 1B colors, 144Hz, 1000 nits (peak) TFT LCD, 120Hz
Display Size 13.2 inches, 518.8 cm2 (~91.5% screen-to-body ratio)
2880 x 1920 pixels, 3:2 ratio (~262 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 289.1 x 196.1 x 5.5 mm 267.3 x 167.4 x 6.9 mm
Body Weight 580g 495g
Body Type Stylus support Glass front, aluminum frame, aluminum back
Colors Golden Black, Green Space Gray
摄像头
Rear Camera Dual: 13 MP, f/1.8, (wide), PDAF + 8 MP, f/2.2, (ultrawide) 5 MP, f/2.2, AF
Front Camera 16 MP, f/2.2
TOF 3D, (depth/biometrics sensor)
5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.2, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, magnetic accessory connector USB Type-C, OTG
传感器
Sensor Accelerometer, gyro, proximity, compass Accelerometer
GPS GPS, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (6 speakers)
-22.2 LUFS (Excellent)
Yes, with stereo speakers (6 speakers)
3.5mm Jack No No

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