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OPPO Pad SE 对比 Honor Pad X8a

Price: RM699   RM675   799
发布
Release Status Release 2025, May 15 Release 2024, Oct 18
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Mediatek Helio G100 (6 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Mali-G57 MC2 Adreno 610
Memory 4GB RAM, 128GB ROM 8GB of RAM (including 4GB HONOR RAM Turbo), 128GB ROM
Card Slot No No
Battery 9340 mAh battery
33W wired, 33W UFCS, PD
Li-Ion 8300 mAh, non-removable battery
OS Android 15, ColorOS 15 Android 14, MagicOS 8
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 500 nits (peak) TFT LCD, 90Hz, 400 nits
Display Size 11.0 inches, 350.9 cm2 (~82.7% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~206 ppi density)
11.0 inches, 350.9 cm2 (~81.0% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~206 ppi density)
机身
Body Dimension 254.9 x 166.5 x 7.4 mm 257 x 168.5 x 7.3 mm
Body Weight 530g 495g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum frame, aluminum back
Colors Starlight Silver, Twilight Blue Space Gray
摄像头
Rear Camera 5 MP, f/2.2, (wide), AF 5 MP, f/2.2, AF
Front Camera 5 MP, f/2.2, (wide) 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features Panorama
Selfie: Panorama
HDR
连接与通讯
Sim Card Nano-SIM - cellular model only No
Data Speed LTE - cellular model only
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.4, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0 USB Type-C, OTG
传感器
Sensor Accelerometer, proximity (accessories only), compass (LTE model only) Accelerometer
GPS GPS, GLONASS (cellular model only) No
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (4 speakers)
3.5mm Jack 3.5mm audio jack No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio

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