Realme Pad 2 对比 Honor Pad 9

Price: RM899   1299 RM1479   1799
发布
Release Status Release 2023, Sep 01 Release 2024, Apr 22
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Mediatek MT8781 Helio G99 (6nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Mali-G57 MC2 Adreno 710
Memory 6GB RAM, 128GB ROM 256GB, 16GB RAM
Card Slot microSDXC (uses shared SIM slot) microSDXC (cellular model only)
Battery Li-Po 8360 mAh, non-removable battery
33W wired
Li-Po 8300 mAh, non-removable battery
35W wired
OS Android 13, Realme UI 4 Android 13, Magic OS 7.2
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 450 nits (peak) IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 11.5 inches, 376.4 cm2
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 6.9 mm
Body Weight 568g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Colors Gray, Green Space Gray, Cyan Lake
摄像头
Rear Camera 8 MP 13 MP, f/2.0, (wide), AF
Front Camera 8 MP 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card Nano-SIM Yes
Data Speed HSPA, LTE LTE, 5G
WLAN Yes Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth Yes 5.1, A2DP, LE
NFC No No
USB USB Type-C USB Type-C 2.0, OTG
传感器
Sensor Fingerprint (side-mounted), unspecified sensors Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (8 speakers)
-22.0 LUFS (Excellent)
3.5mm Jack No No

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