realme Pad X 对比 Redmi Pad SE

Price: RM709   1699 RM729   799
发布
Release Status Release 2022, May 26 Release 2023, Sep 27
性能与续航
CPU Octa-core (2x2.2 GHz Kryo 660 Gold & 6x1.7 GHz Kryo 660 Silver) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6375 Snapdragon 695 5G (6 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 619 Adreno 610
Memory 6GB RAM, 128GB ROM 8GB RAM, 256GB ROM
Card Slot microSDXC microSDXC
Battery Li-Po 8340 mAh, non-removable battery
Fast charging 33W
Reverse charging
USB Power Delivery
Li-Po 8000 mAh, non-removable battery
10W wired
OS Android, Realme UI 3.0 Android 13, MIUI Pad 14
显示屏
Display Type IPS LCD, 450 nits (peak) IPS LCD, 90Hz, 400 nits (typ)
Display Size 10.95 inches, 341.3 cm2 (~82.6% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~213 ppi density)
11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm
Body Weight 499g 478g
Body Type Glass front, plastic frame, plastic back
Stylus support (magnetic charging)
Glass front, aluminum back, aluminum frame
Colors Glowing Gray, Glacier Blue Lavender Purple, Graphite Gray, Mint Green
摄像头
Rear Camera 13 MP, f/2.2, (wide) 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF
Front Camera 8 MP, f/2.0, 105˚ (ultrawide) 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features Panorama
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by) No
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 b/g/n/ac, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C 2.0, USB On-The-Go USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only)
GPS No No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No
24-bit/192kHz audio
Yes
24-bit/192kHz audio

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