realme Pad 对比 Honor Pad X9

Price: RM599   999 RM679   1099
发布
Release Status Release 2021, Nov 03 Release 2023, Jul 20
性能与续航
CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Mediatek MT6769V/CU Helio G80 (12 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Mali-G52 MC2 Adreno 610
Memory 4GB + 64GB 128GB, 4GB RAM
Card Slot microSDXC (uses shared SIM slot) No
Battery Li-Po 7100 mAh, non-removable battery
Fast charging 18W
Reverse charging
Li-Po 7250 mAh, non-removable battery
OS Android 11 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 360 nits (typ) TFT LCD, 120Hz
Display Size 10.4 inches, 307.9 cm2 (~80.2% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~224 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 246.1 x 155.9 x 6.9 mm 267.3 x 167.4 x 6.9 mm
Body Weight 440g 495g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame, aluminum back
Colors Gray, Gold Space Gray
摄像头
Rear Camera 8 MP 5 MP, f/2.2, AF
Front Camera 8 MP, 105˚ (ultrawide) 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card Nano-SIM No
Data Speed HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0, USB On-The-Go USB Type-C, OTG
传感器
Sensor Accelerometer, gyro, proximity Accelerometer
GPS Yes, with A-GPS, GLONASS, BDS
音频
Loud Speaker Yes, with stereo speakers (4 speakers)
-22.4 LUFS (Excellent)
Yes, with stereo speakers (6 speakers)
3.5mm Jack Yes
24-bit/192kHz audio
No

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