Redmi Pad SE 4G对比

	Selected: 搜寻: *输入型号搜索 Redmi Pad SE 4G	Selected: 搜寻: *输入型号搜索	Selected: 搜寻: *输入型号搜索
Price:	从 RM485
发布
Release Status	Coming soon. Exp. release 2024, August 08
性能与续航
CPU	Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)
Chipset	Mediatek Helio G85 (12 nm)
GPU	Mali-G52 MC2
Memory	8GB RAM, 256GB ROM
Card Slot	microSDXC (dedicated slot)
Battery	6650 mAh, non-removable battery 10W wired
OS	Android 14, HyperOS
显示屏
Display Type	IPS LCD, 1B colors, 90Hz, 600 nits (HBM)
Display Size	8.7 inches, 214.9 cm2 (~80.9% screen-to-body ratio) 800 x 1340 pixels, 5:3 ratio (~179 ppi density)
Display Features	Corning Gorilla Glass 3
机身
Body Dimension	211.6 x 125.5 x 8.8 mm
Body Weight	370g
Body Type	Glass front (Gorilla Glass 3) IP53, dust and splash resistant
Colors	Forest Green, Ocean Blue, Urban Grey
摄像头
Rear Camera	8 MP, f/2.0, (wide), 1/4.0", 1.12µm
Front Camera	5 MP, f/2.2, (wide), 1/5.0", 1.12µm
Video	1080p@30fps Selfie: 1080p@30fps
连接与通讯
Sim Card	Dual SIM (Nano-SIM, dual stand-by)
Data Speed	HSPA, LTE
WLAN	Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth	5.3, A2DP, LE
NFC	No
Infrared	Yes
USB	USB Type-C 2.0
传感器
Sensor	Accelerometer, proximity (accessories only), compass Virtual proximity sensing
GPS	GPS, GALILEO, GLONASS, BDS
音频
Loud Speaker	Yes, with stereo speakers
3.5mm Jack	Yes