Redmi Pad SE 对比 Honor Pad 8

Price: RM729   799 RM599   1399
发布
Release Status Release 2023, Sep 27 Release 2022, Aug 25
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 610 Adreno 610
Memory 8GB RAM, 256GB ROM 128GB, 6GB RAM
Card Slot microSDXC No
Battery Li-Po 8000 mAh, non-removable battery
10W wired
Li-Po 7250 mAh, non-removable battery
Fast charging 22.5W
Reverse charging 5W
OS Android 13, MIUI Pad 14 Android 12, Magic UI 6.1
显示屏
Display Type IPS LCD, 90Hz, 400 nits (typ) IPS LCD, 1B colors, 350 nits (typ)
Display Size 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
12.0 inches, 409.9 cm2 (~84.5% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~194 ppi density)
机身
Body Dimension 255.5 x 167.1 x 7.4 mm 278.5 x 174.1 x 6.9 mm
Body Weight 478g 520g
Body Type Glass front, aluminum back, aluminum frame Glass front, aluminum frame, aluminum back
Stylus support
Colors Lavender Purple, Graphite Gray, Mint Green Blue Hour
摄像头
Rear Camera 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF 5 MP
Front Camera 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm 5 MP
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot
Bluetooth 5.0, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C, USB On-The-Go
传感器
Sensor Accelerometer, proximity (accessories only) Accelerometer
GPS No Unspecified
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (8 speakers)
3.5mm Jack Yes
24-bit/192kHz audio
No

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