Honor Pad 8 对比 Honor Pad 9

Price: RM599   1399 RM1249   1499
发布
Release Status Release 2022, Aug 25 Release 2024, Mar 20
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Adreno 610 Adreno 710
Memory 128GB, 6GB RAM 256GB, 8GB RAM
Card Slot No No
Battery Li-Po 7250 mAh, non-removable battery
Fast charging 22.5W
Reverse charging 5W
8300 mAh, non-removable battery
35W wired
OS Android 12, Magic UI 6.1 Android 13, Magic OS 7.2
显示屏
Display Type IPS LCD, 1B colors, 350 nits (typ) IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 12.0 inches, 409.9 cm2 (~84.5% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~194 ppi density)
12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.5 x 174.1 x 6.9 mm 278.2 x 180.1 x 7 mm
Body Weight 520g 559g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum frame, aluminum back
Stylus support
Colors Blue Hour Space Gray, Cyan Lake
摄像头
Rear Camera 5 MP 13 MP, f/2.0, (wide), AF
Front Camera 5 MP 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash LED flash
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, USB On-The-Go USB Type-C 2.0, OTG
传感器
Sensor Accelerometer Accelerometer
GPS Unspecified No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (8 speakers)
3.5mm Jack No No

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