Honor Pad 8 对比 Realme Pad 2

Price: RM599   1399 RM1149   1499
发布
Release Status Release 2022, Aug 25 Release 2023, Sep 01
性能与续航
CPU Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 680 4G (6 nm) Mediatek MT8781 Helio G99 (6nm)
GPU Adreno 610 Mali-G57 MC2
Memory 128GB, 6GB RAM 8GB RAM, 256GB ROM
Card Slot No microSDXC (uses shared SIM slot)
Battery Li-Po 7250 mAh, non-removable battery
Fast charging 22.5W
Reverse charging 5W
Li-Po 8360 mAh, non-removable battery
33W wired
OS Android 12, Magic UI 6.1 Android 13, Realme UI 4
显示屏
Display Type IPS LCD, 1B colors, 350 nits (typ) IPS LCD, 1B colors, 120Hz, 450 nits (peak)
Display Size 12.0 inches, 409.9 cm2 (~84.5% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~194 ppi density)
11.5 inches, 376.4 cm2
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 278.5 x 174.1 x 6.9 mm
Body Weight 520g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Colors Blue Hour Gray, Green
摄像头
Rear Camera 5 MP 8 MP
Front Camera 5 MP 8 MP
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No Nano-SIM
Data Speed HSPA, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot Yes
Bluetooth 5.1, A2DP, LE Yes
NFC No No
USB USB Type-C, USB On-The-Go USB Type-C
传感器
Sensor Accelerometer Fingerprint (side-mounted), unspecified sensors
GPS Unspecified
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No No

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