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Honor Pad 9 对比 Honor Pad 9 Pro

Price: RM880   1499
发布
Release Status Release 2024, Mar 20 Available. Released 2024, July 12
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (4x2.85 GHz Cortex-A78 & 4x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Mediatek Dimensity 8100 (5 nm)
GPU Adreno 710 Mali-G610 MC6
Memory 256GB, 8GB RAM 256GB 12GB RAM, 256GB 8GB RAM
Card Slot No No
Battery 8300 mAh, non-removable battery
35W wired
Li-Po 10050 mAh, non-removable battery
35W wired
OS Android 13, Magic OS 7.2 Android 14, Magic OS 8.
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) IPS LCD, 1B colors, 144Hz
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
12.1 inches, 424.5 cm2 (~85.2% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 7 mm 277 x 179.9 x 6.6 mm
Body Weight 559g 589g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray, Cyan Lake Sky Blue, Star Gray
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 13 MP, f/2.0, (wide), AF
Front Camera 8 MP, f/2.2, (wide) 5 MP, f/2.2, (wide)
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.2, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C 2.0, OTG
传感器
Sensor Accelerometer Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (8 speakers)
3.5mm Jack No No

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