Honor Pad 9 对比 Realme Pad 2

Price: RM1249   1499 RM1002   1499
发布
Release Status Release 2024, Mar 20 Release 2023, Sep 01
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Mediatek MT8781 Helio G99 (6nm)
GPU Adreno 710 Mali-G57 MC2
Memory 256GB, 8GB RAM 8GB RAM, 256GB ROM
Card Slot No microSDXC (uses shared SIM slot)
Battery 8300 mAh, non-removable battery
35W wired
Li-Po 8360 mAh, non-removable battery
33W wired
OS Android 13, Magic OS 7.2 Android 13, Realme UI 4
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) IPS LCD, 1B colors, 120Hz, 450 nits (peak)
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
11.5 inches, 376.4 cm2
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 7 mm
Body Weight 559g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray, Cyan Lake Gray, Green
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 8 MP
Front Camera 8 MP, f/2.2, (wide) 8 MP
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No Nano-SIM
Data Speed HSPA, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Yes
Bluetooth 5.1, A2DP, LE Yes
NFC No No
USB USB Type-C 2.0, OTG USB Type-C
传感器
Sensor Accelerometer Fingerprint (side-mounted), unspecified sensors
GPS No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No No

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