Honor Pad 9 对比 realme Pad X

Price: RM1293   1799 RM709   1699
发布
Release Status Release 2024, Apr 22 Release 2022, May 26
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (2x2.2 GHz Kryo 660 Gold & 6x1.7 GHz Kryo 660 Silver)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Qualcomm SM6375 Snapdragon 695 5G (6 nm)
GPU Adreno 710 Adreno 619
Memory 256GB, 16GB RAM 6GB RAM, 128GB ROM
Card Slot microSDXC (cellular model only) microSDXC
Battery Li-Po 8300 mAh, non-removable battery
35W wired
Li-Po 8340 mAh, non-removable battery
Fast charging 33W
Reverse charging
USB Power Delivery
OS Android 13, Magic OS 7.2 Android, Realme UI 3.0
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) IPS LCD, 450 nits (peak)
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
10.95 inches, 341.3 cm2 (~82.6% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~213 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 6.9 mm
Body Weight 568g 499g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, plastic frame, plastic back
Stylus support (magnetic charging)
Colors Space Gray, Cyan Lake Glowing Gray, Glacier Blue
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 13 MP, f/2.2, (wide)
Front Camera 8 MP, f/2.2, (wide) 8 MP, f/2.0, 105˚ (ultrawide)
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR Panorama
连接与通讯
Sim Card Yes Dual SIM (Nano-SIM, dual stand-by)
Data Speed LTE, 5G HSPA 42.2/5.76 Mbps, LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 b/g/n/ac, hotspot
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C 2.0, USB On-The-Go
传感器
Sensor Accelerometer Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (8 speakers)
-22.0 LUFS (Excellent)
Yes, with stereo speakers (4 speakers)
3.5mm Jack No No
24-bit/192kHz audio

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