Honor Pad X8 对比 Redmi Pad SE

Honor Pad X8
Redmi Pad SE
Price: 从 RM449   899 从 RM620   799
发布
Release Status Release 2022, Nov 03 Release 2023, Sep 27
性能与续航
CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset MediaTek MT8786 Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Mali-G52 Adreno 610
Memory 64GB, 4GB RAM 8GB RAM, 256GB ROM
Card Slot microSDXC (dedicated) microSDXC
Battery Li-Po 5100 mAh, non-removable battery Li-Po 8000 mAh, non-removable battery
10W wired
OS Android 10, Magic UI 4 Android 13, MIUI Pad 14
显示屏
Display Type TFT LCD IPS LCD, 90Hz, 400 nits (typ)
Display Size 10.1 inches, 295.8 cm2 (~77.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~224 ppi density)		 11.0 inches, 347.5 cm2 (~81.4% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
机身
Body Dimension 240.2 x 159 x 7.6 mm 255.5 x 167.1 x 7.4 mm
Body Weight 460g 478g
Body Type Glass front, aluminum back, aluminum frame
Colors Dark Blue, Light Blue Lavender Purple, Graphite Gray, Mint Green
摄像头
Rear Camera 5 MP 8 MP, f/2.0, (wide), 1/4", 1.12µm, AF
Front Camera 2 MP 5 MP, f/2.2, (ultrawide), 1/5", 1.12µm
Video 1080p@30fps
Selfie:		 1080p@30fps
Selfie: 1080p@30fps
连接与通讯
Sim Card Yes No
Data Speed 4G LTE
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.0, A2DP, LE
NFC No No
USB USB Type-C, USB On-The-Go USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer, proximity (accessories only)
GPS Yes, GLONASS, BDS No
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (4 speakers)
3.5mm Jack No Yes
24-bit/192kHz audio

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