Honor Pad X9 对比 Huawei MatePad SE 11

Price: RM679   1099
发布
Release Status Release 2023, Jul 20 Coming soon. Exp. release 2024, June
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Adreno 610
Memory 128GB, 4GB RAM 128GB, 4GB RAM
Card Slot No microSDXC (dedicated slot)
Battery Li-Po 7250 mAh, non-removable battery 7700 mAh, non-removable battery
22.5W wired
5W reverse wired
OS Android 13, MagicOS 7.1 HarmonyOS 2.0
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 400 nits
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
11.0 inches, 350.9 cm2 (~84.9% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~206 ppi density)
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 252.3 x 163.8 x 6.9 mm
Body Weight 495g 475g
Body Type Glass front, aluminum frame, aluminum back Glass front, aluminum frame, aluminum back
Stylus support
Colors Space Gray Nebula Gray, Crystal Blue
摄像头
Rear Camera 5 MP, f/2.2, AF 8 MP, f/2.0, AF
Front Camera 5 MP, f/2.2 5 MP, f/2.2
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 720p@30fps
Camera Features HDR Panorama
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, OTG USB Type-C 2.0, OTG
传感器
Sensor Accelerometer Accelerometer
GPS No
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No Unspecified

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