Honor Pad X9 对比 Redmi Pad Pro

Price: RM909   1499 RM1499  
发布
Release Status Release 2023, Jul 20 Release 2024, Jun 28
性能与续航
CPU Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53) Octa-core (4x2.40 GHz Cortex-A78 & 4x1.95 GHz Cortex-A55)
Chipset Qualcomm SM6225 Snapdragon 685 (6 nm) Qualcomm SM7435-AB Snapdragon 7s Gen 2 (4 nm)
GPU Adreno 610 Adreno 710
Memory 256GB, 8GB RAM 8GB RAM, 256GB ROM
Card Slot No microSDXC (dedicated slot)
Battery Li-Po 7250 mAh, non-removable battery 10000 mAh, non-removable battery
33W wired, PD3.0, QC3+
OS Android 13, MagicOS 7.1 Android 14, HyperOS
显示屏
Display Type TFT LCD, 120Hz IPS LCD, 68B colors, 120Hz, Dolby Vision, 600 nits (HBM)
Display Size 11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
12.1 inches, 424.5 cm2 (~83.4% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Corning Gorilla Glass 3
机身
Body Dimension 267.3 x 167.4 x 6.9 mm 280 x 181.9 x 7.5 mm
Body Weight 495g 571g
Body Type Glass front, aluminum frame, aluminum back Glass front (Gorilla Glass 3), aluminum frame, aluminum back
Stylus support (magnetic)
Colors Space Gray Graphite Gray, Mint Green, Ocean Blue
摄像头
Rear Camera 5 MP, f/2.2, AF 8 MP, f/2.0, (wide), 1/4.0", 1.12µm
Front Camera 5 MP, f/2.2 8 MP, f/2.3, (wide), 1/4.0", 1.12µm
Video 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR LED flash
连接与通讯
Sim Card No No
Data Speed NA
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n/a/6, dual-band, Wi-Fi Direct
Bluetooth 5.1, A2DP, LE 5.2, A2DP, LE, aptX HD, aptX Adaptive
NFC No No
USB USB Type-C, OTG USB Type-C 2.0
传感器
Sensor Accelerometer Accelerometer, gyro, proximity (accessories only), compass
GPS No
音频
Loud Speaker Yes, with stereo speakers (6 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No Yes
24-bit/192kHz Hi-Res audio

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