Redmi Pad 对比 Honor Pad 9

Redmi Pad
Honor Pad 9
Price: 从 RM499   999 从 RM1249   1499
发布
Release Status Release 2022, Oct 05 Release 2024, Mar 20
性能与续航
CPU Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset MediaTek Helio G99 (6nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Mali-G57 MC2 Adreno 710
Memory 4GB RAM, 128GB ROM 256GB, 8GB RAM
Card Slot microSDXC No
Battery Li-Po 8000 mAh, non-removable battery
Fast charging 18W		 8300 mAh, non-removable battery
35W wired
OS Android 12, MIUI 13 Android 13, Magic OS 7.2
显示屏
Display Type IPS LCD, 1B colors, 90Hz, 400 nits (typ) IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~220 ppi density)		 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 250.5 x 158.1 x 7.1 mm 278.2 x 180.1 x 7 mm
Body Weight 465g 559g
Body Type Metal frame Glass front, aluminum frame, aluminum back
Stylus support
Colors Graphite Gray, Moonlight Silver, Mint Green Space Gray, Cyan Lake
摄像头
Rear Camera 8 MP, AF 13 MP, f/2.0, (wide), AF
Front Camera 8 MP, 105° 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps		 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.3, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C USB Type-C 2.0, OTG
传感器
Sensor Yes Accelerometer
GPS Unspecified No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (8 speakers)
3.5mm Jack No No

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