Samsung Galaxy Tab S9 FE Plus 对比 Honor Pad X9

Price: RM1989   3099 RM989   1499
发布
Release Status Release 2023, Oct 04 Release 2023, Jul 20
性能与续航
CPU Octa-core (4x2.4 GHz Cortex-A78 & 4x2.0 GHz Cortex-A55) Octa-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)
Chipset Exynos 1380 (5 nm) Qualcomm SM6225 Snapdragon 685 (6 nm)
GPU Mali-G68 MP5 Adreno 610
Memory 12GB RAM, 256GB ROM 256GB, 8GB RAM
Card Slot microSDXC (dedicated slot) No
Battery Li-Po 10090 mAh, non-removable battery
45W wired, QC2.0
Li-Po 7250 mAh, non-removable battery
OS Android 13, One UI 5.1 Android 13, MagicOS 7.1
显示屏
Display Type IPS LCD, 90Hz TFT LCD, 120Hz
Display Size 12.4 inches, 445.8 cm2 (~84.3% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~243 ppi density)
11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~203 ppi density)
机身
Body Dimension 285.4 x 185.4 x 6.5 mm 267.3 x 167.4 x 6.9 mm
Body Weight 628g 495g
Body Type Glass front, aluminum back, aluminum frame
Stylus
IP68 dust/water resistant (up to 1.5m for 30 min)
Glass front, aluminum frame, aluminum back
Colors Mint, Silver, Gray, Lavender Space Gray
摄像头
Rear Camera Dual: 8 MP, (wide) + 8 MP, (ultrawide) 5 MP, f/2.2, AF
Front Camera 12 MP, (ultrawide) 5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: Yes
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card No. Wifi Version No
Data Speed HSPA, LTE-A (CA), 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.3, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C, magnetic connector USB Type-C, OTG
传感器
Sensor Unspecified Accelerometer
GPS GPS, GLONASS, GALILEO
音频
Loud Speaker Yes, with stereo speakers Yes, with stereo speakers (6 speakers)
3.5mm Jack No
Tuned by AKG
No

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