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Redmi Pad Pro 5G 对比 Honor Pad 9

Price: RM1549   1799 RM880   1499
发布
Release Status Release 2024, Jul 26 Release 2024, Mar 20
性能与续航
CPU Octa-core (4x2.40 GHz Cortex-A78 & 4x1.95 GHz Cortex-A55) Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55)
Chipset Qualcomm SM7435-AB Snapdragon 7s Gen 2 (4 nm) Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm)
GPU Adreno 710 Adreno 710
Memory 6GB RAM, 256GB ROM 256GB, 8GB RAM
Card Slot microSDXC (dedicated slot) No
Battery 10000 mAh, non-removable battery
33W wired, PD3.0, QC3+
8300 mAh, non-removable battery
35W wired
OS Android 14, HyperOS Android 13, Magic OS 7.2
显示屏
Display Type IPS LCD, 120Hz, Dolby Vision, 600 nits IPS LCD, 1B colors, 120Hz, 500 nits (typ)
Display Size 12.1 inches, 424.5 cm2 (~83.4% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
Display Features Corning Gorilla Glass 3 Anti-glare glass
机身
Body Dimension 280 x 181.9 x 7.5 mm 278.2 x 180.1 x 7 mm
Body Weight 566g 559g
Body Type Glass front (Gorilla Glass 3), aluminum frame, aluminum back
Stylus support (magnetic)
Glass front, aluminum frame, aluminum back
Stylus support
Colors Graphite Grey, Mint Green Space Gray, Cyan Lake
摄像头
Rear Camera 8 MP 13 MP, f/2.0, (wide), AF
Front Camera 8 MP 8 MP, f/2.2, (wide)
Video 1080p@30fps
Selfie: 1080p@30fps
4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash, HDR LED flash
连接与通讯
Sim Card Dual SIM (Nano-SIM, dual stand-by) No
Data Speed HSPA, LTE, 5G
WLAN Wi-Fi 802.11 a/b/g/n/a/6, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct
Bluetooth 5.2, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0 USB Type-C 2.0, OTG
传感器
Sensor Accelerometer, gyro, proximity (accessories only), compass Accelerometer
GPS GPS, GALILEO, GLONASS, BDS, QZSS No
音频
Loud Speaker Yes, with stereo speakers (4 speakers) Yes, with stereo speakers (8 speakers)
3.5mm Jack Yes
24-bit/192kHz Hi-Res audio
No

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