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Honor Pad 9 对比 Honor Pad X8a

Price: RM880   1499 RM675   799
发布
Release Status Release 2024, Mar 20 Release 2024, Oct 18
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) Qualcomm SM6225 Snapdragon 680 4G (6 nm)
GPU Adreno 710 Adreno 610
Memory 256GB, 8GB RAM 8GB of RAM (including 4GB HONOR RAM Turbo), 128GB ROM
Card Slot No No
Battery 8300 mAh, non-removable battery
35W wired
Li-Ion 8300 mAh, non-removable battery
OS Android 13, Magic OS 7.2 Android 14, MagicOS 8
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) TFT LCD, 90Hz, 400 nits
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
11.0 inches, 350.9 cm2 (~81.0% screen-to-body ratio)
1200 x 1920 pixels, 16:10 ratio (~206 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 7 mm 257 x 168.5 x 7.3 mm
Body Weight 559g 495g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Glass front, aluminum frame, aluminum back
Colors Space Gray, Cyan Lake Space Gray
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 5 MP, f/2.2, AF
Front Camera 8 MP, f/2.2, (wide) 5 MP, f/2.2
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features LED flash HDR
连接与通讯
Sim Card No No
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth 5.1, A2DP, LE 5.1, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C, OTG
传感器
Sensor Accelerometer Accelerometer
GPS No No
音频
Loud Speaker Yes, with stereo speakers (8 speakers) Yes, with stereo speakers (4 speakers)
3.5mm Jack No No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio

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