Honor Pad 9 对比 Redmi Pad

Price: RM1479   1799 RM659   1099
发布
Release Status Release 2024, Apr 22 Release 2022, Oct 05
性能与续航
CPU Octa-core (4x2.2 GHz Cortex-A78 & 4x1.8 GHz Cortex-A55) Octa-core (2x2.2 GHz Cortex-A76 & 6x2.0 GHz Cortex-A55)
Chipset Qualcomm SM6450 Snapdragon 6 Gen 1 (4 nm) MediaTek Helio G99 (6nm)
GPU Adreno 710 Mali-G57 MC2
Memory 256GB, 16GB RAM 6GB RAM, 128GB ROM
Card Slot microSDXC (cellular model only) microSDXC
Battery Li-Po 8300 mAh, non-removable battery
35W wired
Li-Po 8000 mAh, non-removable battery
Fast charging 18W
OS Android 13, Magic OS 7.2 Android 12, MIUI 13
显示屏
Display Type IPS LCD, 1B colors, 120Hz, 500 nits (typ) IPS LCD, 1B colors, 90Hz, 400 nits (typ)
Display Size 12.1 inches, 424.5 cm2 (~84.7% screen-to-body ratio)
1600 x 2560 pixels, 16:10 ratio (~249 ppi density)
10.61 inches, 320.4 cm2 (~80.9% screen-to-body ratio)
1200 x 2000 pixels, 5:3 ratio (~220 ppi density)
Display Features Anti-glare glass
机身
Body Dimension 278.2 x 180.1 x 6.9 mm 250.5 x 158.1 x 7.1 mm
Body Weight 568g 465g
Body Type Glass front, aluminum frame, aluminum back
Stylus support
Metal frame
Colors Space Gray, Cyan Lake Graphite Gray, Moonlight Silver, Mint Green
摄像头
Rear Camera 13 MP, f/2.0, (wide), AF 8 MP, AF
Front Camera 8 MP, f/2.2, (wide) 8 MP, 105°
Video 4K@30fps, 1080p@30fps
Selfie: 1080p@30fps
1080p@30fps
Selfie: 1080p@30fps
Camera Features HDR
连接与通讯
Sim Card Yes No
Data Speed LTE, 5G
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.1, A2DP, LE 5.3, A2DP, LE
NFC No No
USB USB Type-C 2.0, OTG USB Type-C
传感器
Sensor Accelerometer Yes
GPS No Unspecified
音频
Loud Speaker Yes, with stereo speakers (8 speakers)
-22.0 LUFS (Excellent)
Yes, with stereo speakers (4 speakers)
3.5mm Jack No No

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